Finally,the preventive actions on how to prevent plastic encapsulated IC from delamination are addressed.

目前塑封集成電路的分層問題越來越受到半導(dǎo)體集成電路封裝廠商以及整機廠商的關(guān)注和重視。

Resolutions and Effect of Delamination on Reliability for Plastic Packaging ICs

塑封集成電路離層對可靠性的影響及解決方法

Semiconductor integrated circuits--Specification for stamped lead frames of plastic DIP

GB/T14112-1993半導(dǎo)體集成電路塑料雙列封裝沖制型引線框架規(guī)范

Synthesis of Hexaphenylamine Cyclotriphosphazene Flame Retardant and Its Application in Epoxy Molding Compound for Large-scale Integrated Circuit Packaging

六苯胺環(huán)三磷腈的制備及其對大規(guī)模集成電路封裝用環(huán)氧模塑料的無鹵阻燃

Terminology of packages for semiconductor integrated circuits

GB/T14113-1993半導(dǎo)體集成電路封裝術(shù)語

Electrical Simulation Research for IC Package Via

集成電路封裝基板過孔電學(xué)仿真技術(shù)研究

Study on a New Al-1%Si Bonding Wire for Encapsulation of Integrate Circuit;

集成電路封裝用新型Al-1%Si鍵合線的研制

The Design of Auto-inspection System of IC Package Quality;

集成電路封裝質(zhì)量自動檢測系統(tǒng)的設(shè)計

The usual shapes and lengths of tin whisker in electronic integrated circuit (ECI) encapsulation industry were introduced.

介紹了電子集成電路封裝行業(yè)中常見的錫須的形狀及長度。

Cost Management Mode and Its Application in IC Assembly and Test Enterprises;

集成電路封裝測試企業(yè)成本管理模式及應(yīng)用研究

The Analysis and Research of Transfer Molding Technology in Micro-electronics Plastics Packages;

微電子塑封傳遞模塑成型技術(shù)的分析與研究

silicon grid PMOS type integrated circuit

硅柵pmos集成電路

Design of Integrate Circuit CAD

集成電路cad設(shè)計

mos array integrated circuit

mos陣列集成電路

RAC Rambus Asic Cell

Rambus集成電路單元

silicon gate MOS integrated circuit

硅柵ＭＯＳ集成電路

TTL digital integral-circuit

TTL數(shù)字集成電路

Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits

GB/T14862-1993半導(dǎo)體集成電路封裝結(jié)到外殼熱阻測試方法

The Company's primary business is IC component packaging and test and memory module assembly.

公司的主要業(yè)務(wù)是集成電路封裝測試和內(nèi)存模塊裝配。