Thermal stress analysis and fatigue life prediction for solder joint of SCSP;
疊層芯片封裝元件熱應(yīng)力分析及焊點壽命預(yù)測
To solve the problem of high sensitivity to position of component that exists in the algorithms widely used in Automatic Optical Inspection(AOI) for chip component, an automatic optical inspection algorithm is presented.
該文針對片狀元件提出一種檢測算法,根據(jù)元件局部特征區(qū)域的灰度變化,通過引入局部主波概率,利用主波特性描述標本圖像與被測元件圖像之間的相似度,從而判斷元件是否存在缺陷并確定缺陷種類。
Study on Protel DXP Packaging Components Library
Protel DXP元件封裝庫的研究
Development&Application of Tracking Filter Based on Closed-Form Modeling of SMD;
基于貼片元件封裝模型的寬范圍跟蹤濾波網(wǎng)絡(luò)的設(shè)計與應(yīng)用
Effect of Hydrogen on the Reliability of Microelectronic Devices
氫對金屬封裝密封元器件可靠性的影響
The FEA Simulation of Moisture Diffusion in Electronic Packages;
塑料電子封裝件中濕擴散有限元分析
General specification for electronic components plastic packaging equipments
GB/T13947-1992電子元器件塑料封裝設(shè)備通用技術(shù)條件
FEA Method of High-power Semiconductor Encapsulation
大功率半導(dǎo)體器件封裝結(jié)構(gòu)的有限元分析
In relation to an integrated circuit;a term that indicates small element size and high packing density.
集成電路技術(shù)中的一種修飾術(shù)語，表示元件體積小而且封裝密度高。
encapsulated fuel unit
加密封套的燃料元件
Analysis on the Relation between EMC Property and Packaging Defect
淺析環(huán)氧塑封料性能與器件封裝缺陷
Development of Anti-aging Coating for Rubber Parts of Armored Equipment
裝甲裝備橡膠密封件抗老化封存膜的研制
This new material provides a main ehannal to solve the heat matching of electronic device package.
它的出現(xiàn)為解決電子元器件的封裝熱匹配問題提供了一條有效途徑。
The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.
減少元件和電路的幾何尺寸，以達到增加電路的封裝密度、減少功耗和減小信號傳播延遲的目的。
Finite element analysis on soldered joint reliability of QFN device
QFN封裝焊點可靠性的有限元分析
Finite Element Analysis on Rubber Sealing Y-ring in the Condition of Static Seal
靜密封條件下Y形橡膠密封圈有限元分析
Research on Assembly Reliability and Sealing Properties of the Bearing Sealed Ring;
軸承密封件安裝穩(wěn)定性與密封特性研究
A preassembled unit.
預(yù)裝件預(yù)先組裝好的元件
BASIC ELECTRICAL UNITS
基本電氣元件和裝置
Place the components listed below inside the chamber in the order given.
按如下順序裝配各元件
